印制電路printed circuit

 

    印制線路 printed wiring

 

    印制板 printed board

 

    印制板電路 printed circuit board

 

    印制線路板 printed wiring board

 

    印制元件 printed component

 

    印制接點 printed contact

 

    印制板裝配 printed board assembly

 

    板 boardnbsp;

 

    剛性印制板 rigid printed board

 

    撓性印制電路 flexible printed circuit

 

    撓性印制線路 flexible printed wiring

 

    齊平印制板 flush printed board

 

    金屬芯印制板 metal core printed board

 

    金屬基印制板 metal base printed board

 

    多重布線印制板 mulit-wiring printed board

 

    塑電路板 molded circuit board

 

    散線印制板 discrete wiring board

 

    微線印制板 micro wire board

 

    積層印制板 buile-up printed board

 

    表面層合電路板 surface laminar circuit

 

    埋入凸塊連印制板 B2it printed board

 

    載芯片板 chip on board

 

    埋電阻板 buried resistance board

 

    母板 mother board

 

    子板 daughter board

 

    背板 backplane

 

    裸板 bare board

 

    鍵盤板夾心板 copper-invar-copper board

 

    動態(tài)撓性板 dynamic flex board

 

    靜態(tài)撓性板 static flex board

 

    可斷拼板 break-away planel

 

    電纜 cable

 

    撓性扁平電纜 flexible flat cable (FFC)

 

    薄膜開關 membrane switch

 

    混合電路 hybrid circuit

 

    厚膜 thick film

 

    厚膜電路 thick film circuit

 

    薄膜 thin film

 

    薄膜混合電路 thin film hybrid circuit

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    互連 interconnection

 

    導線 conductor trace line

 

    齊平導線 flush conductor

 

    傳輸線 transmission line

 

    跨交 crossover

 

    板邊插頭 edge-board contact

 

    增強板 stiffener

 

    基底 substrate

 

    基板面 real estate

 

    導線面 conductor side

 

    元件面 component side

 

    焊接面 solder side

 

    導電圖形 conductive pattern

 

    非導電圖形 non-conductive pattern

 

    基材 base material

 

    層壓板 laminate

 

    覆金屬箔基材 metal-clad bade material

 

    覆銅箔層壓板 copper-clad laminate (CCL)

 

    復合層壓板 composite laminate

 

    薄層壓板 thin laminate

 

    基體材料 basis material

 

    預浸材料 prepreg

 

    粘結(jié)片 bonding sheet

 

    預浸粘結(jié)片 preimpregnated bonding sheer

 

    環(huán)氧玻璃基板 epoxy glass substrate

 

    預制內(nèi)層覆箔板 mass lamination panel

 

    內(nèi)層芯板 core material

 

    粘結(jié)層 bonding layer

 

    粘結(jié)膜 film adhesive

 

    無支撐膠粘劑膜 unsupported adhesive film

 

    覆蓋層 cover layer (cover lay)

 

    增強板材 stiffener material

 

    銅箔面 copper-clad surface

 

    去銅箔面 foil removal surface

 

    層壓板面 unclad laminate surface

 

    基膜面 base film surface

 

    膠粘劑面 adhesive faec

 

    原始光潔面 plate finish

 

    粗面 matt finish

 

    剪切板 cut to size panel

 

    超薄型層壓板 ultra thin laminate

 

    A階樹脂 A-stage resin

 

    B階樹脂 B-stage resin

 

    C階樹脂 C-stage resin

 

    環(huán)氧樹脂 epoxy resin

 

    酚醛樹脂 phenolic resin

 

    聚酯樹脂 polyester resin

 

    聚酰亞胺樹脂 polyimide resin

 

    雙馬來酰亞胺三嗪樹脂 bismaleimide-triazine resin

 

    丙烯酸樹脂 acrylic resin

 

    三聚氰胺甲醛樹脂 melamine formaldehyde resin

 

    多官能環(huán)氧樹脂 polyfunctional epoxy resin

 

    溴化環(huán)氧樹脂 brominated epoxy resin

 

    環(huán)氧酚醛 epoxy novolac

 

    氟樹脂 fluroresin

 

    硅樹脂 silicone resin

 

    硅烷 silane

 

    聚合物 polymer

 

    無定形聚合物 amorphous polymer

 

    結(jié)晶現(xiàn)象 crystalline polamer

 

    雙晶現(xiàn)象 dimorphism

 

    共聚物 copolymer

 

    合成樹脂 synthetic

 

    熱固性樹脂 thermosetting resin [Page]

 

    熱塑性樹脂 thermoplastic resin

 

    感光性樹脂 photosensitive resin

 

    環(huán)氧值 epoxy value

 

    雙氰胺 dicyandiamide

 

    粘結(jié)劑 binder

 

    膠粘劑 adesive

 

    固化劑 curing agent

 

    阻燃劑 flame retardant

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    遮光劑 opaquer

 

    增塑劑 plasticizers

 

    不飽和聚酯 unsatuiated polyester

 

    聚酯薄膜 polyester

 

    聚酰亞胺薄膜 polyimide film (PI)

 

    聚四氟乙烯 polytetrafluoetylene (PTFE)

 

    增強材料 reinforcing material

 

    折痕 crease

 

    云織 waviness

 

    魚眼 fish eye

 

    毛圈長 feather length

 

    厚薄段 mark

 

    裂縫 split

 

    捻度 twist of yarn

 

    浸潤劑含量 size content

 

    浸潤劑殘留量 size residue

 

    處理劑含量 finish level

 

    偶聯(lián)劑 couplint agent

 

    斷裂長 breaking length

 

    吸水高度 height of capillary rise

 

    濕強度保留率 wet strength retention

 

    白度 whitenness

 

    導電箔 conductive foil

 

    銅箔 copper foil

 

    壓延銅箔 rolled copper foil

 

    光面 shiny sidenbsp;

 

    粗糙面 matte sidenbsp;

 

    處理面 treated sidenbsp;

 

    防銹處理 stain proofingnbsp;

 

    雙面處理銅箔 double treated foilnbsp;

 

    模擬 simulation

 

    邏輯模擬 logic simulation

 

    電路模擬 circit simulation

 

    時序模擬 timing simulation

 

    模塊化 modularization

 

    設計原點 design origin

 

    優(yōu)化（設計） optimization (design)

 

    供設計優(yōu)化坐標軸 predominant axis

 

    表格原點 table origin

 

    元件安置 component positioning

 

    比例因子 scaling factor

 

    掃描填充 scan filling

 

    矩形填充 rectangle filling

 

    填充域 region filling

 

    實體設計 physical design

 

    邏輯設計 logic design

 

    邏輯電路 logic circuit

 

    層次設計 hierarchical design

 

    自頂向下設計 top-down design

 

    自底向上設計 bottom-up design

 

    費用矩陣 cost metrix

 

    元件密度 component density

 

    自由度 degrees freedom

 

    出度 out going degree

 

    入度 incoming degree

 

    曼哈頓距離 manhatton distance

 

    歐幾里德距離 euclidean distance

 

    網(wǎng)絡 network

 

    陣列 array

 

    段 segment

 

    邏輯 logic

 

    邏輯設計自動化 logic design automation

 

    分線 separated time

 

    分層 separated layer

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    定順序 definite sequence

 

    導線（通道） conduction (track)

 

    導線（體）寬度 conductor width

 

    導線距離 conductor spacing

 

    導線層 conductor layer

 

    導線寬度/間距 conductor line/space

 

    第一導線層 conductor layer No.1

 

    圓形盤 round pad

 

    方形盤 square pad

 

    菱形盤 diamond pad

 

    長方形焊盤 oblong pad

 

    ****形盤 bullet pad

 

    淚滴盤 teardrop pad

 

    雪人盤 snowman pad

 

    形盤 V-shaped pad V

 

    環(huán)形盤 annular pad

 

    非圓形盤 non-circular pad

 

    隔離盤 isolation pad

 

    非功能連接盤 monfunctional pad

 

    偏置連接盤 offset land

 

    腹（背）裸盤 back-bard land

 

    nbsp;盤址 anchoring spaur

 

    連接盤圖形 land pattern

 

    連接盤網(wǎng)格陣列 land grid array

 

    孔環(huán) annular ring

 

    元件孔 component hole

 

    安裝孔 mounting hole

 

    支撐孔 supported hole

 

    非支撐孔 unsupported hole

 

    導通孔 via

 

    鍍通孔 plated through hole (PTH)

 

    余隙孔 access hole

 

    盲孔 blind via (hole)

 

    埋孔 buried via hole

 

    埋,盲孔 buried blind via

 

    任意層內(nèi)部導通孔 any layer inner via hole

 

    全部鉆孔 all drilled hole

 

    定位孔 toaling hole

 

    無連接盤孔 landless hole

 

    中間孔 interstitial hole

 

    無連接盤導通孔 landless via hole

 

    引導孔 pilot hole

 

    端接全隙孔 terminal clearomee hole

 

    準尺寸孔 dimensioned hole [Page]

 

    在連接盤中導通孔 via-in-pad

 

    孔位 hole location

 

    孔密度 hole density

 

    孔圖 hole pattern

 

    鉆孔圖 drill drawing

 

    裝配圖assembly drawingnbsp;

 

    參考基準 datum referan